Comments on: Nikon is co-funding a 3D R&D project in Japan http://nikonrumors.com/2008/12/09/nikon-is-co-funding-a-3d-rd-project-in-japan.aspx/ where there’s smoke there’s fire Thu, 24 May 2012 20:47:06 +0000 hourly 1 By: ChrisL http://nikonrumors.com/2008/12/09/nikon-is-co-funding-a-3d-rd-project-in-japan.aspx/comment-page-1/#comment-12033 ChrisL Wed, 10 Dec 2008 02:37:11 +0000 http://nikonrumors.com/?p=2095#comment-12033 The 3D (as in stereoscopic) Fuji camera mentioned at the end of this blog posting is *entirely unrelated* to making 3D chips (i.e., with the circuitry stacked into multiple layers, rather than a single layer as at present.). And any camera using it would not be a "3D camera" any more than current cameras are "integrated circuit" cameras. However, the circuitry might be smaller, or take less power. The 3D (as in stereoscopic) Fuji camera mentioned at the end of this blog posting is *entirely unrelated* to making 3D chips (i.e., with the circuitry stacked into multiple layers, rather than a single layer as at present.).

And any camera using it would not be a “3D camera” any more than current cameras are “integrated circuit” cameras. However, the circuitry might be smaller, or take less power.

]]> By: Pablov http://nikonrumors.com/2008/12/09/nikon-is-co-funding-a-3d-rd-project-in-japan.aspx/comment-page-1/#comment-12025 Pablov Tue, 09 Dec 2008 21:26:44 +0000 http://nikonrumors.com/?p=2095#comment-12025 maybe this is the way to improve and make different kind of sensors wich would allow to pass the limit of MP that we are reaching today (keeping the noise level "under control") ? maybe this is the way to improve and make different kind of sensors wich would allow to pass the limit of MP that we are reaching today (keeping the noise level “under control”) ?

]]> By: Paul http://nikonrumors.com/2008/12/09/nikon-is-co-funding-a-3d-rd-project-in-japan.aspx/comment-page-1/#comment-12001 Paul Tue, 09 Dec 2008 16:09:37 +0000 http://nikonrumors.com/?p=2095#comment-12001 At most, this could be applied to the imaging silicon, maybe to bring the A/D converters even closer to the photosite, or getting larger photosites by putting the interconnects on lower layers of silicon (not unlike multilayer PCBs) As for a 3D camera...that's not what this is about. At most, this could be applied to the imaging silicon, maybe to bring the A/D converters even closer to the photosite, or getting larger photosites by putting the interconnects on lower layers of silicon (not unlike multilayer PCBs)

As for a 3D camera…that’s not what this is about.

]]> By: Nikkorian http://nikonrumors.com/2008/12/09/nikon-is-co-funding-a-3d-rd-project-in-japan.aspx/comment-page-1/#comment-11997 Nikkorian Tue, 09 Dec 2008 14:40:01 +0000 http://nikonrumors.com/?p=2095#comment-11997 At first, it seems that mostly the size of compact cameras would benefit from the smaller footprint of ICs being built 3D-style in several layers using TSV (through-silicon via) connections between the layers. But then I found this report abstract about a toshiba CMOS imaging sensor called "Dynastron" using TSVs. Also I remembered that in the sensors produced by now Sigma-owned Foveon the light-sensitive silicon is layered, so they might be using TSV as well. Maybe Nikon is hopping onto a trend? http://www.chipworks.com/seamark.aspx?sm=s4%3BDatedfl10%3BDeviceType17%3BCMOS+Image+Sensorfl10%3BReportCode12%3BCWR-0809-802&cw=detail At first, it seems that mostly the size of compact cameras would benefit from the smaller footprint of ICs being built 3D-style in several layers using TSV (through-silicon via) connections between the layers.

But then I found this report abstract about a toshiba CMOS imaging sensor called “Dynastron” using TSVs. Also I remembered that in the sensors produced by now Sigma-owned Foveon the light-sensitive silicon is layered, so they might be using TSV as well. Maybe Nikon is hopping onto a trend?

http://www.chipworks.com/seamark.aspx?sm=s4%3BDatedfl10%3BDeviceType17%3BCMOS+Image+Sensorfl10%3BReportCode12%3BCWR-0809-802&cw=detail

]]> By: Olaf http://nikonrumors.com/2008/12/09/nikon-is-co-funding-a-3d-rd-project-in-japan.aspx/comment-page-1/#comment-11994 Olaf Tue, 09 Dec 2008 13:37:33 +0000 http://nikonrumors.com/?p=2095#comment-11994 I suppose the article refers to a technique about stacking several integrated circuit in a single package, and the solution to interconnect the layers. The "3D" feature means that the package is developed in 3 dimensions, contrary to the current method in which a package contains a single bidimensional integrated circuit. Not directly related to 3D imaging. I suppose the article refers to a technique about stacking several integrated circuit in a single package, and the solution to interconnect the layers. The “3D” feature means that the package is developed in 3 dimensions, contrary to the current method in which a package contains a single bidimensional integrated circuit. Not directly related to 3D imaging.

]]> By: Anonymous http://nikonrumors.com/2008/12/09/nikon-is-co-funding-a-3d-rd-project-in-japan.aspx/comment-page-1/#comment-11993 Anonymous Tue, 09 Dec 2008 13:28:16 +0000 http://nikonrumors.com/?p=2095#comment-11993 This looks like nikon precision rather than nikon imaging This looks like nikon precision rather than nikon imaging

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